Intel thinks glass substrates are a clear winner in multi-die packagingTobias Mannon September 18, 2023 at 21:46 The Register


Don’t get too excited, tech won’t be ready until the end of the decade

Intel’s latest gambit to keep Moores’ Law on life support involves ditching organic substrates — the intermediary through which data and power flows on its way in and out of a compute die — for glass ones.…

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